Hi focus plasma cutting
For this separation process, gas is ionized with electrical energy, with electrons being released from the outer atom shells. When the gas molecules strike the electrically conductive object to be cut, the electrons return to their original state, thereby releasing their reconfiguration energy. Temperatures of up to 30,000 K are reached at the point of impact. The high temperature and high kinetic energy content of the plasma beam melt or partially evaporate the material.
The efficiency of today's plasma cutting systems is between 80 and 90%; this means that its connected load is significantly lower than a CO2 laser with a comparable cutting performance.